射頻積體電路 (RFIC) 晶片主要可分為功率放大器 (power amplifier)、收發器 (transceiver)、鎖相迴路 (phase lock loop) 三大部分。目前鎖相迴路與收發器已逐漸整合於系統晶片 (SoC)，剩下的功率放大器成為最後等待整合的聖杯 (Holy Grail)。功率放大器大量使用於手機、Wi-Fi無線區域網路、平板電腦、藍芽等網通產品，如GSM手機...

Prof. Dr. Fernando Gregorio received the B.Sc. degree from the Universidad Tecnologica Nacional (UTN), Bahía Blanca, Argentina, the M.Sc. degree in electrical engineering from the Universidad Nacio...

EditorsDevashish Shrivastava, In Vivo Temperatures, LLC, USAJ. Thomas Vaughan, Columbia University in the City of New York, USA

Satoshi Horikoshi, Sophia University, Department of Materials and Life Sciences (Associate Professor). Microwave Science Research Center MSRC (Director). Satoshi Horikoshi received his Ph.D. degree...

Robert Sobot received the B.Sc. degree in engineering physics from the University of Belgrade, ex-Yugoslavia, in 1989, and the M.A.Sc. and the Ph.D. degrees in electrical engineering from Simon Fra...

The book is intended for readers with anexisting base of knowledge regarding the wireless power amplifier (PA), a keysemiconductor component used in all wireless communication products. The PAinflu...

Daniel Talbot has been named a Life Member of IEEE for his membership of over 50 years and a member of Eta Kappa Nu, and also named a Fellow of the Audio Engineering Society for his accomplishments...